The production of Tumtec consists of two parts, making processing such as extrusion, die casting, and stamping, as well as the deep process such as drilling, milling, and welding. Its robust structure allows it to be used in harsh environments
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During the developing stage of Tumtec , air velocity, choice of material, protrusion, and surface treatment have been seriously considered by the R&D department who strives to achieve optimized thermal dissipation effect. It can reduce the electrical signal loss and provides the highest efficiency
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Tumtec is an exclusively designed thermal solution for particular applications. By enlarging its heat radiating area or optimizing the materials in the circulation parts is often conducted to check its heat dissipation performance. It is widely used in different electronics industries, such as telecommunication and consumer electronics
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Tumtec is developed after careful consideration. It is created based on the theory of maximum heat dissipation for devices by our in-house R&D department. Its working panel is coated with a photo-sensitive epoxy-based ink, which can ensure its insulation resistance
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The law of heat conduction theory has been adopted in the developing of Tumtec . It's specially made to allow the heat to be transferred from the higher temperature region to the lower temperature region. It has passed AOI which ensures there will be no errors or welding defects
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Our professional technicians monitor the quality of products throughout the production process, which greatly ensures the quality of products. It is widely used in different electronics industries, such as telecommunication and consumer electronics